• Create a large (2000×2000) BMP containing only Black and White
• You should create a new Package so the logo can be put on multiple boards.
• Click File>Run then Browse to import-bmp.ulp in the “ulp” directory.
• Load your bmp
• Select only the logo color
• Scale by a factor to get desired size
• Select Layer 21 to start
• Run Script

• Double click a library in the Control Panel or start a new one.

• A symbol is the schematic portion of the part.
  • Create a box or outline in layer 94 (Symbol)
  • Add and label pins for easier reference later
  • Name on Name Layer, Values on Value Layer
  • Update Description so it can be searched when creating schematics.

• A Package is the physical pcb layout of the part.
  • Lay down parts
  • Create Dimensional Layer in tDocu
  • Add Silkscreen to tPlace/bPlace
  • Add Name/Value to tName/tValue
  • Update Description so it can be searched when creating boards.

• A device is a link between Package and Symbol
  • Drop Schematic Part
  • Escape Escape
  • Click “New” in Package area
  • Select Package
  • Connect Pins to Pads
  • Change Variant
  • Enter Description
• Click “Library” > “Update All” in the design window
• Add attributes: (makes BOM generation easier)
  • Digikey# with the appropriate number
  • Part# with the manufacturer's part number
  • EAGLEUP with key to 3D model

Finding parts in Libraries is hard. If you want to keep all your parts in one place, I suggest moving them all to your library. To do this, follow these steps:

• Double click your library to open it.
• Find the part you want.
• Right click and select “copy to library”
• Save your library.

• Change the name of all connecting signals to GND. You must use the “Name” tool to change names.
• Select the Polygon tool.
  • Select the applicable layer.
  • Change width to 0.010 in
  • Change isolation to an appropriate value.
• Draw a polygon around the area you want a groundplane.
• Click the ratsnest button to draw the plane.

• Layout Board
• Print Board Name, Date, and Revision
• Click CAM
• Click File>Open>Job
• Browse to the SFE *.cam file
• Click “Process Job”
• Gather these files from project directory
  • Project.GBL- Bottom Traces
  • Project.GBO- Bottom Silk Screen
  • Project.GBS- Bottom Solder Mask
  • Project.GTL- Top Traces
  • Project.GTO- Top Silk Screen
  • Project.GTS- Top Solder Mask
  • Project.TXT- Drill File
• Zip files together
• Open Viewplot
• Click Load Files and select all the files
• For drill file, click Leading Zero Suppression and then 2:4
• Check the layout like a HAWK

• Use “miter” tool to round edges of board.

• Download create_drill_line_array1.21.zip
• Unzip and place files in EAGLE\ulp\
• In Eagle, create box of zero width with the Line tool in Layer 46 (Milling). It is important to use the Line tool, not the circle tool.
• Use the miter tool to round the corners to create a circle or whatever other shape you want.
• Click File>Run…
• Select “create_drill_line_array.ulp”
• The Script will space the drills/vias equally around the line in the milling layer.
• Delete the Milling Line.

• 1 Top: Top layer of copper traces
• 16 Bottom: Bottom layer of copper traces
• 17 Pads:
• 18 Vias:
• 19
• 20 Dimension: Board outline, circles are holes
• 21 tPlace: Top layer for silkscreen
• 22 bPlace: Bottom layer for silkscreen
• 23
• 24
• 25 tName: Part Names, may or may not be included in silkscreen (ex- R1, C2)
• 26
• 27 tValue: Part Values, may or may not be included in silkscreen (ex- 5k, 10uF)
• 28
• 29 tStop: Solder stop mask, top side
• 30 bStop: Solder stop mask, bottom side
• 31
• 32
• 33
• 34
• 35
• 36
• 37
• 38
• 39
• 40
• 41
• 42
• 43
• 44 Drills
• 45 Holes
• 46 Milling
• 47
• 48
• 49
• 50
• 51 tDocu- (top) used for package dimensions or other documentation
• 52 bDocu- (bottom) used for package dimensions or other documentation

For a more through description: Eagle Help: Layer