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Eagle_Guide

Creating Silkscreen Graphics

  • Create a large (2000×2000) BMP containing only Black and White
  • You should create a new Package so the logo can be put on multiple boards.
  • Click File>Run then Browse to import-bmp.ulp in the “ulp” directory.
  • Load your bmp
  • Select only the logo color
  • Scale by a factor to get desired size
  • Select Layer 21 to start
  • Run Script

Creating Parts

  • Double click a library in the Control Panel or start a new one.

Create a New Symbol

  • A symbol is the schematic portion of the part.
    • Create a box or outline in layer 94 (Symbol)
    • Add and label pins for easier reference later
    • Name on Name Layer, Values on Value Layer
    • Update Description so it can be searched when creating schematics.

Create a New Package

  • A Package is the physical pcb layout of the part.
    • Lay down parts
    • Create Dimensional Layer in tDocu
    • Add Silkscreen to tPlace/bPlace
    • Add Name/Value to tName/tValue
    • Update Description so it can be searched when creating boards.

Create a New Device

  • A device is a link between Package and Symbol
    • Drop Schematic Part
    • Escape Escape
    • Click “New” in Package area
    • Select Package
    • Connect Pins to Pads
    • Change Variant
    • Enter Description
  • Click “Library” > “Update All” in the design window
  • Add attributes: (makes BOM generation easier)
    • Digikey# with the appropriate number
    • Part# with the manufacturer's part number
    • EAGLEUP with key to 3D model

Library Management

Finding parts in Libraries is hard. If you want to keep all your parts in one place, I suggest moving them all to your library. To do this, follow these steps:

  • Double click your library to open it.
  • Find the part you want.
  • Right click and select “copy to library”
  • Save your library.

Creating Circuit Boards

Generating a Ground Plane

  • Change the name of all connecting signals to GND. You must use the “Name” tool to change names.
  • Select the Polygon tool.
    • Select the applicable layer.
    • Change width to 0.010 in
    • Change isolation to an appropriate value.
  • Draw a polygon around the area you want a groundplane.
  • Click the ratsnest button to draw the plane.

Layout/CAM

  • Layout Board
  • Print Board Name, Date, and Revision
  • Click CAM
  • Click File>Open>Job
  • Browse to the SFE *.cam file
  • Click “Process Job”
  • Gather these files from project directory
    • Project.GBL- Bottom Traces
    • Project.GBO- Bottom Silk Screen
    • Project.GBS- Bottom Solder Mask
    • Project.GTL- Top Traces
    • Project.GTO- Top Silk Screen
    • Project.GTS- Top Solder Mask
    • Project.TXT- Drill File
  • Zip files together
  • Open Viewplot
  • Click Load Files and select all the files
  • For drill file, click Leading Zero Suppression and then 2:4
  • Check the layout like a HAWK

Helpful Tips

  • Use “miter” tool to round edges of board.

How to Create an Array

  • Unzip and place files in EAGLE\ulp\
  • In Eagle, create box of zero width with the Line tool in Layer 46 (Milling). It is important to use the Line tool, not the circle tool.
  • Use the miter tool to round the corners to create a circle or whatever other shape you want.
  • Click File>Run…
  • Select “create_drill_line_array.ulp”
  • The Script will space the drills/vias equally around the line in the milling layer.
  • Delete the Milling Line.

Layer Guide

  • 1 Top: Top layer of copper traces
  • 16 Bottom: Bottom layer of copper traces
  • 17 Pads:
  • 18 Vias:
  • 19
  • 20 Dimension: Board outline, circles are holes
  • 21 tPlace: Top layer for silkscreen
  • 22 bPlace: Bottom layer for silkscreen
  • 23
  • 24
  • 25 tName: Part Names, may or may not be included in silkscreen (ex- R1, C2)
  • 26
  • 27 tValue: Part Values, may or may not be included in silkscreen (ex- 5k, 10uF)
  • 28
  • 29 tStop: Solder stop mask, top side
  • 30 bStop: Solder stop mask, bottom side
  • 31
  • 32
  • 33
  • 34
  • 35
  • 36
  • 37
  • 38
  • 39
  • 40
  • 41
  • 42
  • 43
  • 44 Drills
  • 45 Holes
  • 46 Milling
  • 47
  • 48
  • 49
  • 50
  • 51 tDocu- (top) used for package dimensions or other documentation
  • 52 bDocu- (bottom) used for package dimensions or other documentation

For a more through description: Eagle Help: Layer

eagle_guide.txt · Last modified: 2014/09/29 12:09 by admin