Eagle_Guide
Creating Silkscreen Graphics
Create a large (2000×2000) BMP containing only Black and White
You should create a new Package so the logo can be put on multiple boards.
Click File>Run then Browse to import-bmp.ulp in the “ulp” directory.
Load your bmp
Select only the logo color
Scale by a factor to get desired size
Select Layer 21 to start
Run Script
Creating Parts
Create a New Symbol
Create a New Package
Create a New Device
A device is a link between Package and Symbol
Click “Library” > “Update All” in the design window
Add attributes: (makes BOM generation easier)
Digikey# with the appropriate number
Part# with the manufacturer's part number
EAGLEUP with key to 3D model
Library Management
Finding parts in Libraries is hard. If you want to keep all your parts in one place, I suggest moving them all to your library. To do this, follow these steps:
Creating Circuit Boards
Generating a Ground Plane
Change the name of all connecting signals to GND. You must use the “Name” tool to change names.
Select the Polygon tool.
Draw a polygon around the area you want a groundplane.
Click the ratsnest button to draw the plane.
Layout/CAM
Layout Board
Print Board Name, Date, and Revision
Click CAM
Click File>Open>Job
Browse to the SFE *.cam file
Click “Process Job”
Gather these files from project directory
Project.GBL- Bottom Traces
Project.GBO- Bottom Silk Screen
Project.GBS- Bottom Solder Mask
Project.GTL- Top Traces
Project.GTO- Top Silk Screen
Project.GTS- Top Solder Mask
Project.TXT- Drill File
Zip files together
Open Viewplot
Click Load Files and select all the files
For drill file, click Leading Zero Suppression and then 2:4
Check the layout like a HAWK
Helpful Tips
How to Create an Array
-
Unzip and place files in EAGLE\ulp\
In Eagle, create box of zero width with the Line tool in Layer 46 (Milling). It is important to use the Line tool, not the circle tool.
Use the miter tool to round the corners to create a circle or whatever other shape you want.
Click File>Run…
Select “create_drill_line_array.ulp”
The Script will space the drills/vias equally around the line in the milling layer.
Delete the Milling Line.
Layer Guide
1 Top: Top layer of copper traces
16 Bottom: Bottom layer of copper traces
17 Pads:
18 Vias:
19
20 Dimension: Board outline, circles are holes
21 tPlace: Top layer for silkscreen
22 bPlace: Bottom layer for silkscreen
23
24
25 tName: Part Names, may or may not be included in silkscreen (ex- R1, C2)
26
27 tValue: Part Values, may or may not be included in silkscreen (ex- 5k, 10uF)
28
29 tStop: Solder stop mask, top side
30 bStop: Solder stop mask, bottom side
31
32
33
34
35
36
37
38
39
40
41
42
43
44 Drills
45 Holes
46 Milling
47
48
49
50
51 tDocu- (top) used for package dimensions or other documentation
52 bDocu- (bottom) used for package dimensions or other documentation
For a more through description: Eagle Help: Layer